In-mold
Embedded during the manufacture of a compatible item.
The microtransponder
Small enough
to become part of it.
A complete transponder on a silicon die, with a fixed identifier and no battery on the item.
Discuss your application
500 × 500 µmDie dimensions
100 µmDie thickness
Light-activatedLaser or LED
Fixed IDFactory-programmed
Identity at the item
One silicon die.
Several ways to fit.
Power, memory, logic and an antenna are integrated into the microtransponder. Light supplies the operating energy; the die returns its identifier to a compatible reader.
Placement can be in-mold, within a label construction, directly on a component or alongside a printed code. The right construction depends on the item and its workflow.
Attachment & integration
Design the identity in.
Placement is evaluated together with durability and reader access.
The practical details
Fit the chip.
Validate the assembly.
Is a fixed ID the same as a secure workflow?
A fixed ID supports item identification. Registration, attachment, reader controls, event handling and the integration determine the assurance of the complete workflow.
Can the chip be read through a covering?
Supported read-through conditions depend on the covering, light transmission, placement and reader configuration. These conditions are part of an application review.
What determines durability?
The die, attachment and host material must be considered together. Temperature, chemistry, duration, cycling and post-exposure reading requirements are evaluated for the application.
Let’s make it work
Start with one
critical checkpoint.
Tell us what you need to identify, what it has to withstand, and where the record needs to go.
Discuss your application